more »
Engineers at the NIST Center for Nanoscale Science and Technology (CNST) have developed a new technique for fabricating high aspect ratio three-dimensional (3D) nanostructures over large device areas using a combination of electron beam (e-beam) lithography, photolithography, and resist spray coating. While it has long been possible to make complicated 3D structures with many mask layers or expensive grayscale masks, the new technique enables researchers to etch trenches and other high aspect ratio structures with nanometer scale features without using masks and in only two process stages.
Zazzle Space market place
Engineers at the NIST Center for Nanoscale Science and Technology (CNST) have developed a new technique for fabricating high aspect ratio three-dimensional (3D) nanostructures over large device areas using a combination of electron beam (e-beam) lithography, photolithography, and resist spray coating. While it has long been possible to make complicated 3D structures with many mask layers or expensive grayscale masks, the new technique enables researchers to etch trenches and other high aspect ratio structures with nanometer scale features without using masks and in only two process stages.
Zazzle Space market place
No comments:
Post a Comment