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Thermal considerations are rapidly becoming one of the most serious design constraints in microelectronics, especially on submicron scale lengths. A study by researchers from the University of Illinois at Urbana-Champaign has shown that standard thermal models will lead to the wrong answer in a three-dimensional heat-transfer problem if the dimensions of the heating element are on the order of one micron or smaller.
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Thermal considerations are rapidly becoming one of the most serious design constraints in microelectronics, especially on submicron scale lengths. A study by researchers from the University of Illinois at Urbana-Champaign has shown that standard thermal models will lead to the wrong answer in a three-dimensional heat-transfer problem if the dimensions of the heating element are on the order of one micron or smaller.
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